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Shenzhen Medson Technology Co., Ltd.
 
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Shenzhen Medson Technology Co., Ltd.
[China]
Address:
Room 2618，East Zone of Huaneng Building,No. 2068,ShenNan Middle Road, Futian District Shenzhen Guangdong 518055 China
Phone:
86-0755-33203129
Contact name:
Ivy Wang , Oversea sales representative
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Shenzhen Medson Technology Co., Ltd.
 
Products

PCB(Double-Sided Oil Carbon Bonding Immersion Gold)
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PCB(Double-Sided Oil Carbon Bonding Immersion Gold)
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 Model Number MEDSON1

Item            Type              Standard capability
1     PCB Layer PCB         2-8 Layer
2 PCB Process           HAL
      Flash Gold
     Immersion gold
    HAL/Gold finger board
     Immersion sn
         OSP
3       Materials       FR-4   CEM-3
      Copper foil        0.50Z-50Z
    Board thickness        0.3mm-0.38mm
4     Max work sheer        480mm×510mm
 
5       0.75%
6     Min hole size        0.30mm
    Max PTH hole         6.5mm
       +0.075mm+0.13mm
7    Min Line width&spacing   H/HOZ 0.10mm 1/10.13mm 2/20ZO.25mm
8    Min copper foil(hole)    350u-450u(AU)800u-1000u(HAL)
      Min annular ring   H/HOZ 0.10mm 1/10.13mm 2/20ZO.25mm
9    Ni/A1.1 thickness   Ni 150u-200u·AU O 5u·-1u Au·-5u·
     Tin thickness            1000u·-300u·
  Min solder master window           0.08mm
  Min solder master birdge           0.13mm
      Min silks creen     0.15ram×0.8mm×1.0mm

 
10    Bule peel thickness       0.25mm-0.5mm
11    Profile tolerance         CNC±0.10mm
12        V.cut size   Max:380mm×380mm   Min 80mm×80mm

 
13        V.cut thickness              0.6mm
14        V.cut angle         45°/30°/25°

Related Keywords: PCB , PCBA


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